Low-damage high-throughput grazing-angle sputter deposition on graphene
Creators
- 1. IBM Thomas J. Watson Research Center, Yorktown Heights, New York 10598 (United States)
- 2. Politecnico di Torino, Turin 10129 (Italy)
Description
Despite the prevalence of sputter deposition in the microelectronics industry, it has seen very limited applications for graphene electronics. In this letter, we report systematic investigation of the sputtering induced damages in graphene and identify the energetic sputtering gas neutrals as the primary cause of graphene disorder. We further demonstrate a grazing-incidence sputtering configuration that strongly suppresses fast neutral bombardment and retains graphene structure integrity, creating considerably lower damage than electron-beam evaporation. Such sputtering technique yields fully covered, smooth thin dielectric films, highlighting its potential for contact metals, gate oxides, and tunnel barriers fabrication in graphene device applications
Additional details
Identifiers
- DOI
- 10.1063/1.4813911;
- arXiv
- arXiv:1303.3325v2;
Publishing Information
- Journal Title
- Applied Physics Letters
- Journal Volume
- 103
- Journal Issue
- 3
- Journal Page Range
- p. 033109-033109.5
- ISSN
- 0003-6951
- CODEN
- APPLAB
INIS
- Country of Publication
- United States
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 44078622
- Subject category
- S36: MATERIALS SCIENCE; S77: NANOSCIENCE AND NANOTECHNOLOGY;
- Descriptors DEI
- CONFIGURATION; DAMAGE; DEPOSITION; DIELECTRIC MATERIALS; ELECTRON BEAMS; EQUIPMENT; EVAPORATION; FILMS; GRAPHENE; METALS; MICROELECTRONICS; RAMAN SPECTRA; SCANNING ELECTRON MICROSCOPY; SPUTTERING; TUNNEL EFFECT
- Descriptors DEC
- BEAMS; CARBON; ELECTRON MICROSCOPY; ELEMENTS; LEPTON BEAMS; MATERIALS; MICROSCOPY; NONMETALS; PARTICLE BEAMS; PHASE TRANSFORMATIONS; SPECTRA
Optional Information
- Notes
- (c) 2013 AIP Publishing LLC