Miniaturized disk-bend testing of Ni3Al
Creators
- 1. California Univ., Los Angeles, CA (United States). Dept. of Materials Science and Engineering
Description
In this paper the results of miniaturized disk-bend tests on samples of Ni3Al of different stoichiometry and boron content are presented. The yield strengths and ductilities of alloys containing 24, 25 or 26 %Al, either boron-free or doped with 0.3 or 0.35 %B, were measured. Specimens 3 mm in diameter and approximately 200 μm thick were tested, some of these having been cut from the grip sections of previously tested tensile bars. The yield strengths were in excellent agreement with the results obtained from the uniaxial tensile tests. The load-displacement curves for the brittle alloys (all but the boron-doped 24 % Al alloy) exhibited a maximum load corresponding to crack initiation. The shapes of the deformed specimens confirmed the assumption that they deform as if they were clamped even though they are not. The fracture surfaces of the brittle alloys are consistent with intergranular failure
Additional details
Additional titles
- Subtitle (English)
- Effect of stoichiometry and boron content
Publishing Information
- Publisher
- Materials Research Society.
- Imprint Place
- Pittsburgh, PA (United States)
- ISBN
- 1-55899-105-0
- Imprint Title
- High-temperature ordered intermetallic alloys 4
- Imprint Pagination
- 1082 p.
- Journal Page Range
- p. 757-762.
Conference
- Title
- Fall meeting of the Materials Research Society (MRS).
- Dates
- 24 Nov - 1 Dec 1990.
- Place
- Boston, MA (United States).
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 23041775
- Subject category
- S36: MATERIALS SCIENCE;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ALUMINIUM ALLOYS; BORON; DOPED MATERIALS; GRAIN BOUNDARIES; METALLURGY; NICKEL BASE ALLOYS; STOICHIOMETRY; TENSILE PROPERTIES; YIELD STRENGTH
- Descriptors DEC
- ALLOYS; CRYSTAL STRUCTURE; ELEMENTS; MATERIALS; MECHANICAL PROPERTIES; MICROSTRUCTURE; NICKEL ALLOYS; SEMIMETALS
Optional Information
- Secondary number(s)
- CONF-901105--.