A review of standardization issues for total reflection X-ray fluorescence and vapor phase decomposition/total reflection X-ray fluorescence

Total reflection X-ray fluorescence (TXRF) and vapor phase decomposition (VPD) followed by TXRF have become widespread methods for measuring surface metal contamination on silicon wafers. For quantification, TXRF and VPD/TXRF require reference samples. Since the approaches to making and using these reference samples have significantly varied among TXRF manufacturers and users worldwide, there exists some confusion about the quantification of TXRF and VPD/TXRF. This paper summarizes the basic issues behind TXRF and VPD/TXRF quantification using reference samples. (author)