Published March 22, 2004 | Version v1
Journal article

Electric-field effect on metal induced crystallization of amorphous silicon

Description

Anomalous crystallization behavior has been found for metal induced crystallization (MIC) of amorphous silicon (a-Si). The Ni density of ∼1013 atoms/cm2 was deposited uniformly over whole a-Si layer and then the 2nd Ni layer was selectively deposited onto the a-Si using a shadow mask with Ni density of ∼1015 atoms/cm2. The crystallization started at first in the high Ni density (approx. 1015 atoms/cm2) region as a result of MIC in an electric field and then the a-Si in low Ni density (approx. 1013 atoms/cm2) region was laterally crystallized. However, the lateral crystallization proceeded in radial direction from the high Ni density region, forming disk-like grains, even though a parallel bias-field was applied. Then, the crystallization speed increased with the electric field strength. The lateral crystallization speed showed an exponential relationship with the electric field as r=roeαE with constant ro and α of 2.2x10-2 cm/V. The dependence appears to be due to the reduction in the activation of Ni diffusion in an electric field

Additional details

Identifiers

DOI
10.1016/j.tsf.2003.11.057;
PII
S0040609003016249;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
451-452
Journal Issue
3
Journal Page Range
p. 320-323
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
Symposium D on thin film and nano-structured materials for photovoltaics
Acronym
E-MRS 2003 spring conference
Dates
10-13 Jun 2003
Place
Strasbourg (France)

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
37019261
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
CRYSTALLIZATION; DENSITY; DIFFUSION; ELECTRIC FIELDS; LAYERS; SILICON
Descriptors DEC
ELEMENTS; PHASE TRANSFORMATIONS; PHYSICAL PROPERTIES; SEMIMETALS

Optional Information

Copyright
Copyright (c) 2003 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.