Published 1989
| Version v1
Book
Influence of substrate on cracking of vapor-deposited thin films due to residual stresses
Creators
- 1. Lawrence Berkeley Lab., CA (USA). Center for Advanced Materials
Description
The influence of the substrate material on the column and grain microstructure, the residual stresses, crack patterns and delamination of Cr films has been investigated using TEM, SEM, and X-ray diffraction. The inter-influence of these factors which determine the long term reliability of microelectronics is discussed. When interfacial adhesion is very low, as may be the case with some polymer substrates, cracking occurs discontinuously during film formation each time the stress exceeds the critical value for fracture
Additional details
Publishing Information
- Publisher
- Materials Research Society.
- Imprint Place
- Pittsburgh, PA (USA)
- ISBN
- 1-55899-026-7
- Imprint Title
- Interfaces between polymers, metals, and ceramics
- Imprint Pagination
- 426 p.
- Series
- Materials Research Society symposium proceedings.
- Journal Page Range
- p. 299-304.
Conference
- Title
- Spring meeting of the Materials Research Society.
- Dates
- 24-28 Apr 1989.
- Place
- San Diego, CA (USA).
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 21074553
- Subject category
- S36: MATERIALS SCIENCE; S36: MATERIALS SCIENCE; S37: INORGANIC, ORGANIC, PHYSICAL AND ANALYTICAL CHEMISTRY;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- CHEMICAL VAPOR DEPOSITION; CHROMIUM; CRACKING; METALLURGY; MICROELECTRONICS; MICROSTRUCTURE; POLYMERS; RELIABILITY; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; THIN FILMS; TRANSMISSION ELECTRON MICROSCO; X-RAY DIFFRACTION
- Descriptors DEC
- CHEMICAL COATING; CHEMICAL REACTIONS; COHERENT SCATTERING; CRYSTAL STRUCTURE; DECOMPOSITION; DEPOSITION; DIFFRACTION; ELECTRON MICROSCOPY; ELEMENTS; FILMS; METALS; MICROSCOPY; PYROLYSIS; SCATTERING; STRESSES; SURFACE COATING; TRANSITION ELEMENTS
Optional Information
- Secondary number(s)
- CONF-890426--.