Published 1989 | Version v1
Book

Influence of substrate on cracking of vapor-deposited thin films due to residual stresses

  • 1. Lawrence Berkeley Lab., CA (USA). Center for Advanced Materials

Description

The influence of the substrate material on the column and grain microstructure, the residual stresses, crack patterns and delamination of Cr films has been investigated using TEM, SEM, and X-ray diffraction. The inter-influence of these factors which determine the long term reliability of microelectronics is discussed. When interfacial adhesion is very low, as may be the case with some polymer substrates, cracking occurs discontinuously during film formation each time the stress exceeds the critical value for fracture

Additional details

Publishing Information

Publisher
Materials Research Society.
Imprint Place
Pittsburgh, PA (USA)
ISBN
1-55899-026-7
Imprint Title
Interfaces between polymers, metals, and ceramics
Imprint Pagination
426 p.
Series
Materials Research Society symposium proceedings.
Journal Page Range
p. 299-304.

Conference

Title
Spring meeting of the Materials Research Society.
Dates
24-28 Apr 1989.
Place
San Diego, CA (USA).

Optional Information

Secondary number(s)
CONF-890426--.