Microstructural evolution during transient liquid phase bonding of Inconel 738LC using AMS 4777 filler alloy

IN-738LC nickel-based superalloy was joined by transient liquid phase diffusion bonding using AMS 4777 filler alloy. The bonding process was carried out at 1050 °C under vacuum atmosphere for various hold times. Microstructures of the joints were studied by optical and scanning electron microscopy. Continuous centerline eutectic phases, characterized as nickel-rich boride, chromium-rich boride and nickel-rich silicide were observed at the bonds with incomplete isothermal solidification. In addition to the centerline eutectic products, precipitation of boron-rich particles was observed in the diffusion affected zone. The results showed that, as the bonding time was increased to 75 min, the width of the eutectic zone was completely removed and the joint was isothermally solidified. Homogenization of isothermally solidified joints at 1120 °C for 300 min resulted in the elimination of intermetallic phases formed at the diffusion affected zone and the formation of significant γ′ precipitates in the joint region. - Highlights: ► TLP bonding of IN-738LC superalloy was performed using AMS 4777 filler alloy. ► Insufficient diffusion time resulted in the formation of eutectic product. ► Precipitation of B-rich particles was observed within the DAZ. ► The extent of isothermal solidification increased with increasing holding time. ► Homogenizing of joints resulted in the dissolution of DAZ intermetallics.