Published January 23, 2008 | Version v1
Journal article

Organic memory using [6,6]-phenyl-C61 butyric acid methyl ester: morphology, thickness and concentration dependence studies

  • 1. Center for Functional Materials and Department of Physics, Abo Akademi University, Porthansgatan 3, Turku, FIN-20500 (Finland)
  • 2. Department of Engineering Physics and Mathematics, and Center for New Materials, Helsinki University of Technology, Nanopoli, PO Box 5100, FIN-02015 HUT (Finland)
  • 3. NanoMaterials Group, Laboratory of Physics and Center for New Materials, Helsinki University of Technology, PO Box 5100, FIN-02015 TKK (Finland)

Description

We report a simple memory device in which the fullerene-derivative [6,6]-phenyl-C61 butyric acid methyl ester (PCBM) mixed with inert polystyrene (PS) matrix is sandwiched between two aluminum (Al) electrodes. Transmission electron microscopy (TEM) images of PCBM:PS films showed well controlled morphology without forming any aggregates at low weight percentages (<10 wt%) of PCBM in PS. Energy dispersive x-ray spectroscopy (EDX) analysis of the device cross-sections indicated that the thermal evaporation of the Al electrodes did not lead to the inclusion of Al metal nanoparticles into the active PCBM:PS film. Above a threshold voltage of <3 V, independent of thickness, a consistent negative differential resistance (NDR) is observed in devices in the thickness range from 200 to 350 nm made from solutions with 4-10 wt% of PCBM in PS. We found that the threshold voltage (Vth) for switching from the high-impedance state to the low-impedance state, the voltage at maximum current density (Vmax) and the voltage at minimum current density (Vmin) in the NDR regime are constant within this thickness range. The current density ratio at Vmax and Vmin is more than or equal to 10, increasing with thickness. Furthermore, the current density is exponentially dependent on the longest tunneling jump between two PCBM molecules, suggesting a tunneling mechanism between individual PCBM molecules. This is further supported with temperature independent NDR down to 240 K

Additional details

Identifiers

DOI
10.1088/0957-4484/19/03/035203;
PII
S0957-4484(08)58102-5;

Publishing Information

Journal Title
Nanotechnology (Print)
Journal Volume
19
Journal Issue
3
Journal Page Range
p. 035203
ISSN
0957-4484