Numerical Study on the Optimum Heat Transfer Design for Improvement of Mura Phenomenon in the Side Lighting LED BLU

This study aims to improve sheet wrinkles and mura due to the internal heat of light-emitting diode (LED) package (PKG), which is used as a light source of a side-lighting LED (back light unit) BLU. In order to solve the local heating problem, the variations of the conduction heat-transfer characteristics inside the LED BLU with the thickness, length, and thermal conductivity of the metal chassis are numerically investigated, and optimum heat dissipation design conditions are derived. As the thickness and length of the metal chassis increased, the total area of the heat sink decreased, and the overall temperature decreased as the thermal conductivity increased. Based on the results of this study, the correlation equation relating the thickness, length, and thermal conductivity of the metal chassis for the proper management of temperature, which is the main cause of sheet wrinkles and the mura phenomena, is derived.