Effect of self-bias voltage on the wettability, chemical functionality and nanomechanical properties of hexamethyldisiloxane films
- 1. Program of Metallurgical and Materials Engineering, COPPE, Federal University of Rio de Janeiro (UFRJ), P.O. Box 68505, 21941-972 Rio de Janeiro, RJ (Brazil)
- 2. Faculty of Civil Engineering, University Center of Volta Redonda (UniFOA), Volta Redonda, RJ (Brazil)
Description
Copper and silicon substrates were coated by chemical vapor deposition using hexamethyldisiloxane (HMDSO) as the precursor gas. Substrates were placed both at the anode and cathode of a glow discharge reactor, and films were deposited using different self-bias voltages. This study focuses on comparing the differences between the hydrophilicity, polymeric character, chemical structure and nanomechanical properties of HMDSO films produced at the cathode and anode of the reactor at different self-bias voltages. Fourier transform infrared spectroscopy and Raman confocal spectroscopy indicated a significant increase in the content of organic groups when films were deposited at the anode. Analyzing the nanomechanical properties of the cathode and anode films indicated that the penetration depth was higher for samples prepared at the cathode (lower hardness) compared with the samples produced at the anode. The measured contact angles indicated that all samples became hydrophobic with water contact angles close to 100°; however, a different lyophobic character was observed when diiodomethane was used. Films produced at the anode with diiodomethane exhibited higher contact angles than did films produced at the cathode. - Highlights: • Hexamethyldisiloxane (HMDSO) films deposited by CVD on Si and Cu substrates • HMDSO films produced at the anode have greater content of organic SiO4 groups. • Films produced at the anode are harder than those deposited at the cathode. • HMDSO films produced at the cathode exhibited higher elastic recovery. • All films are hydrophobic (θ close to 100°)
Availability note (English)
Available from http://dx.doi.org/10.1016/j.tsf.2014.05.012Additional details
Identifiers
- DOI
- 10.1016/j.tsf.2014.05.012;
- PII
- S0040-6090(14)00547-1;
Publishing Information
- Journal Title
- Thin Solid Films
- Journal Volume
- 564
- Journal Page Range
- p. 73-78
- ISSN
- 0040-6090
- CODEN
- THSFAP
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 47004102
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- ABSORPTION SPECTROSCOPY; CHEMICAL VAPOR DEPOSITION; COMPARATIVE EVALUATIONS; COPPER; ELECTRIC POTENTIAL; GLOW DISCHARGES; HARDNESS; INFRARED SPECTRA; ORGANIC SILICON COMPOUNDS; PENETRATION DEPTH; SILICATES; SILICON; SILICON OXIDES; SUBSTRATES; THIN FILMS; WETTABILITY
- Descriptors DEC
- CHALCOGENIDES; CHEMICAL COATING; DEPOSITION; ELECTRIC DISCHARGES; ELEMENTS; EVALUATION; FILMS; MECHANICAL PROPERTIES; METALS; ORGANIC COMPOUNDS; OXIDES; OXYGEN COMPOUNDS; SEMIMETALS; SILICON COMPOUNDS; SPECTRA; SPECTROSCOPY; SURFACE COATING; TRANSITION ELEMENTS
Optional Information
- Copyright
- Copyright (c) 2014 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.