Published December 2018 | Version v1
Journal article Metadata-only

Influence of tungsten carbide (WC) nanoparticle on microstructure and mechanical properties of Cu/Sn57.6Bi0.4Ag/Cu solder joints

Creators

  • 1. Soochow University, School of Mechanical and Electrical Engineering, Jiangsu (China)
  • 2. Changshu Institute of Technology, School of Automotive Engineering, Jiangsu (China)

Description

The effect of WC nanoparticles on the spreadability, microstructure and mechanical properties of Cu/Sn57.6Bi0.4Ag/Cu solder joints was investigated. The results showed that the spreadability of Sn57.6Bi0.4Ag composite solder was enhanced by WC nanoparticles, and the spreadability was increased first and decreased with increasing WC content next; when the content of WC was 0.1 wt%, the solder got relatively optimal spreadability. The dispersed WC particles provided the heterogeneous nucleation sites during the soldering process and led to the microstructure refinement of Sn57.6Bi0.4Ag solder alloy. WC particles restrained the growth rate of IMC by reducing the surface energy of Cu6Sn5, the shear strength of Sn57.6Bi0.4Ag-xWC/Cu (x = 0, 0.1) solder joints decreased seriously with increasing aging time, WC particles improved the shear strength and toughness of Sn57.6Bi0.4Ag/Cu solder joints by refining the microstructure. (orig.)

Availability note (English)

Available from: http://dx.doi.org/10.1007/s00339-018-2255-4

Additional details

Identifiers

DOI
10.1007/s00339-018-2255-4;

Publishing Information

Journal Title
Applied Physics. A, Materials Science and Processing
Journal Volume
124
Journal Issue
12
Journal Page Range
p. 1-10
ISSN
0947-8396
CODEN
APAMFC

INIS

Country of Publication
Germany
Country of Input or Organization
Germany
INIS RN
50010035
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
AGING; BINARY ALLOY SYSTEMS; BISMUTH ALLOYS; COPPER; COPPER ALLOYS; ENERGY SPECTRA; FRACTURES; INTERFACES; MICROSTRUCTURE; NANOPARTICLES; NUCLEATION; SCANNING ELECTRON MICROSCOPY; SHEAR PROPERTIES; SILVER ADDITIONS; SOLDERED JOINTS; SURFACE ENERGY; TERNARY ALLOY SYSTEMS; TIN ALLOYS; TUNGSTEN CARBIDES; X-RAY SPECTRA
Descriptors DEC
ALLOY SYSTEMS; ALLOYS; CARBIDES; CARBON COMPOUNDS; ELECTRON MICROSCOPY; ELEMENTS; ENERGY; FAILURES; FREE ENERGY; JOINTS; MECHANICAL PROPERTIES; METALS; MICROSCOPY; PARTICLES; PHYSICAL PROPERTIES; REFRACTORY METAL COMPOUNDS; SILVER ALLOYS; SPECTRA; SURFACE PROPERTIES; THERMODYNAMIC PROPERTIES; TRANSITION ELEMENT ALLOYS; TRANSITION ELEMENT COMPOUNDS; TRANSITION ELEMENTS; TUNGSTEN COMPOUNDS