Molecular dynamics simulations of grain boundary sliding: The effect of stress and boundary misorientation
Creators
- 1. Materials and Processes Laboratory, General Motors R and D Center, 30500 Mound Road, Warren, MI 48090-9055 (United States)
Description
Molecular dynamics simulations were used to study the effect of applied force and grain boundary misorientation on grain boundary sliding in aluminum at 750 K. Two grains were oriented with their <1 1 0> axes parallel to their boundary plane and one grain was rotated around its <1 1 0> axis to various misorientation angles. For any given misorientation, increasing the applied force leads to three sliding behaviors: no sliding, constant velocity sliding and a parabolic sliding over time. The last behavior is associated with disordering of atoms along the grain boundary. For the second sliding behavior, the constant sliding velocity varied linearly with the applied stress. A linear fit of this relationship did not intersect the stress axis at the origin, implying that a threshold stress for sliding exists. This threshold stress was found to decrease with increasing grain boundary energy. The ramifications of this finding for modeling grain boundary sliding in polycrystals are discussed
Additional details
Identifiers
- DOI
- 10.1016/j.actamat.2006.10.016;
- PII
- S1359-6454(06)00741-5;
Publishing Information
- Journal Title
- Acta Materialia
- Journal Volume
- 55
- Journal Issue
- 5
- Journal Page Range
- p. 1555-1563
- ISSN
- 1359-6454
- CODEN
- ACMAFD
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 39034710
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- ALUMINIUM; GRAIN BOUNDARIES; MOLECULAR DYNAMICS METHOD; PLASTICITY; POLYCRYSTALS; SIMULATION; STRESSES; TEMPERATURE RANGE 0400-1000 K
- Descriptors DEC
- CALCULATION METHODS; CRYSTALS; ELEMENTS; MECHANICAL PROPERTIES; METALS; MICROSTRUCTURE; TEMPERATURE RANGE
Optional Information
- Copyright
- Copyright (c) 2006 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.