Published March 2007 | Version v1
Journal article

Molecular dynamics simulations of grain boundary sliding: The effect of stress and boundary misorientation

  • 1. Materials and Processes Laboratory, General Motors R and D Center, 30500 Mound Road, Warren, MI 48090-9055 (United States)

Description

Molecular dynamics simulations were used to study the effect of applied force and grain boundary misorientation on grain boundary sliding in aluminum at 750 K. Two grains were oriented with their <1 1 0> axes parallel to their boundary plane and one grain was rotated around its <1 1 0> axis to various misorientation angles. For any given misorientation, increasing the applied force leads to three sliding behaviors: no sliding, constant velocity sliding and a parabolic sliding over time. The last behavior is associated with disordering of atoms along the grain boundary. For the second sliding behavior, the constant sliding velocity varied linearly with the applied stress. A linear fit of this relationship did not intersect the stress axis at the origin, implying that a threshold stress for sliding exists. This threshold stress was found to decrease with increasing grain boundary energy. The ramifications of this finding for modeling grain boundary sliding in polycrystals are discussed

Additional details

Identifiers

DOI
10.1016/j.actamat.2006.10.016;
PII
S1359-6454(06)00741-5;

Publishing Information

Journal Title
Acta Materialia
Journal Volume
55
Journal Issue
5
Journal Page Range
p. 1555-1563
ISSN
1359-6454
CODEN
ACMAFD

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
39034710
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
ALUMINIUM; GRAIN BOUNDARIES; MOLECULAR DYNAMICS METHOD; PLASTICITY; POLYCRYSTALS; SIMULATION; STRESSES; TEMPERATURE RANGE 0400-1000 K
Descriptors DEC
CALCULATION METHODS; CRYSTALS; ELEMENTS; MECHANICAL PROPERTIES; METALS; MICROSTRUCTURE; TEMPERATURE RANGE

Optional Information

Copyright
Copyright (c) 2006 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.