Surface participation and dielectric loss in superconducting qubits
Creators
- 1. Department of Applied Physics and Physics, Yale University, New Haven, Connecticut 06520 (United States)
Description
We study the energy relaxation times (T1) of superconducting transmon qubits in 3D cavities as a function of dielectric participation ratios of material surfaces. This surface participation ratio, representing the fraction of electric field energy stored in a dissipative surface layer, is computed by a two-step finite-element simulation and experimentally varied by qubit geometry. With a clean electromagnetic environment and suppressed non-equilibrium quasiparticle density, we find an approximately proportional relation between the transmon relaxation rates and surface participation ratios. These results suggest dielectric dissipation arising from material interfaces is the major limiting factor for the T1 of transmons in 3D circuit quantum electrodynamics architecture. Our analysis also supports the notion of spatial discreteness of surface dielectric dissipation
Additional details
Identifiers
- DOI
- 10.1063/1.4934486;
- arXiv
- arXiv:1509.01854v2;
Publishing Information
- Journal Title
- Applied Physics Letters
- Journal Volume
- 107
- Journal Issue
- 16
- Journal Page Range
- p. 162601-162601.5
- ISSN
- 0003-6951
- CODEN
- APPLAB
INIS
- Country of Publication
- United States
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 47055920
- Subject category
- S71: CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS;
- Descriptors DEI
- DIELECTRIC MATERIALS; ELECTRIC FIELDS; FINITE ELEMENT METHOD; INTERFACES; LAYERS; QUANTUM ELECTRODYNAMICS; QUBITS; RELAXATION; SIMULATION; SURFACES
- Descriptors DEC
- CALCULATION METHODS; ELECTRODYNAMICS; FIELD THEORIES; INFORMATION; MATERIALS; MATHEMATICAL SOLUTIONS; NUMERICAL SOLUTION; QUANTUM FIELD THEORY; QUANTUM INFORMATION
Optional Information
- Notes
- (c) 2015 AIP Publishing LLC