Published October 15, 2003
| Version v1
Journal article
Influence of Cr23C6 carbides on dynamic recrystallization in hot deformed Nimonic 80a alloys
Creators
Description
Dynamic recrystallization (DRX) in hot deformed Nimonic 80a alloys was investigated with and without the presence of Cr23C6 carbides within grains. Average carbide sizes and dislocation configurations were investigated by transmission electron microscopy, and carbide volume fractions were estimated from small-angle X-ray scattering. A drastic decrease of DRX due to the presence of bulk carbides is found, depending on their size and volume fraction. This can be correlated to modifications of dislocation distributions due to the interactions between carbides and dislocations
Additional details
Identifiers
- DOI
- 10.1016/S0921-5093(03)00329-0;
- arXiv
- arXiv:hep-th/0301011v2;
- PII
- S0921509303003290;
Publishing Information
- Journal Title
- Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing
- Journal Volume
- 358
- Journal Issue
- 1-2
- Journal Page Range
- p. 44-51
- ISSN
- 0921-5093
- CODEN
- MSAPE3
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 38070131
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- CARBIDES; CONFIGURATION; DEFORMATION; DISLOCATIONS; DISTRIBUTION; NIMONIC 80A; RECRYSTALLIZATION; SMALL ANGLE SCATTERING; TRANSMISSION ELECTRON MICROSCOPY; X-RAY DIFFRACTION
- Descriptors DEC
- ALLOY-NI76CR20TI2; ALLOYS; ALUMINIUM ALLOYS; BORON ADDITIONS; BORON ALLOYS; CARBON COMPOUNDS; CHROMIUM ALLOYS; COHERENT SCATTERING; CORROSION RESISTANT ALLOYS; CRYSTAL DEFECTS; CRYSTAL STRUCTURE; DIFFRACTION; ELECTRON MICROSCOPY; HEAT RESISTANT MATERIALS; HEAT RESISTING ALLOYS; LINE DEFECTS; MATERIALS; MICROSCOPY; NICKEL ALLOYS; NICKEL BASE ALLOYS; NIMONIC; SCATTERING; TITANIUM ALLOYS; TRANSITION ELEMENT ALLOYS; ZIRCONIUM ADDITIONS; ZIRCONIUM ALLOYS
Optional Information
- Copyright
- Copyright (c) 2003 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.