Published 2002 | Version v1
Miscellaneous

Ultrasonic wave and stress analysis for bonded joints

  • 1. Soongsil Univ., Seoul (Korea, Republic of)

Description

This article discusses the use of pulse-echo ultrasonic testing for the inspection of adhesive bonds between thin sheet metal bonded joints. The method is based on the ultrasonic wave analysis at the metal/adhesive interface. The physical aspects of the phenomenon, an index is defined to detect stress zone of the joint, the influence of the experimental variables(variable stress...) on the measurement is discussed. By means of a control experiment, it is shown that frequency energy density in adhesive joints was confirmed the transition by stress variation

Part of:
Proceedings of the KSME 2002 spring annual meeting

Additional details

Publishing Information

Publisher
KSME
Imprint Place
Seoul (Korea, Republic of)
Imprint Title
Proceedings of the KSME 2002 spring annual meeting
Imprint Pagination
[CD-ROM]
Journal Page Range
[6 p.]

Conference

Title
2002 spring annual meeting of the KSME
Dates
22-24 May 2002
Place
Pyeongchang (Korea, Republic of)

INIS

Country of Publication
Korea, Republic of
Country of Input or Organization
Korea, Republic of
INIS RN
35102499
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference, Non-conventional Literature
Descriptors DEI
BONDING; ENERGY DENSITY; FRACTURE MECHANICS; JOINTS; MECHANICAL PROPERTIES; STRESS ANALYSIS; STRESS INTENSITY FACTORS; ULTRASONIC WAVES
Descriptors DEC
FABRICATION; JOINING; MECHANICS; SOUND WAVES

Optional Information

Notes
9 refs, 10 figs, 2 tabs