Published 2002
| Version v1
Miscellaneous
Ultrasonic wave and stress analysis for bonded joints
- 1. Soongsil Univ., Seoul (Korea, Republic of)
Description
This article discusses the use of pulse-echo ultrasonic testing for the inspection of adhesive bonds between thin sheet metal bonded joints. The method is based on the ultrasonic wave analysis at the metal/adhesive interface. The physical aspects of the phenomenon, an index is defined to detect stress zone of the joint, the influence of the experimental variables(variable stress...) on the measurement is discussed. By means of a control experiment, it is shown that frequency energy density in adhesive joints was confirmed the transition by stress variation
Additional details
Publishing Information
- Publisher
- KSME
- Imprint Place
- Seoul (Korea, Republic of)
- Imprint Title
- Proceedings of the KSME 2002 spring annual meeting
- Imprint Pagination
- [CD-ROM]
- Journal Page Range
- [6 p.]
Conference
- Title
- 2002 spring annual meeting of the KSME
- Dates
- 22-24 May 2002
- Place
- Pyeongchang (Korea, Republic of)
INIS
- Country of Publication
- Korea, Republic of
- Country of Input or Organization
- Korea, Republic of
- INIS RN
- 35102499
- Subject category
- S36: MATERIALS SCIENCE;
- Resource subtype / Literary indicator
- Conference, Non-conventional Literature
- Descriptors DEI
- BONDING; ENERGY DENSITY; FRACTURE MECHANICS; JOINTS; MECHANICAL PROPERTIES; STRESS ANALYSIS; STRESS INTENSITY FACTORS; ULTRASONIC WAVES
- Descriptors DEC
- FABRICATION; JOINING; MECHANICS; SOUND WAVES
Optional Information
- Notes
- 9 refs, 10 figs, 2 tabs