Published February 2004 | Version v1
Journal article

Potential guidelines for design and fitness for purpose for carbon steel components subject to repeated thermal shock

Description

Thermal shock cracking is an important damage mechanism for many pressurised components. The growth of thermal shock cracks is influenced by a combination of several factors including geometry, the severity of the thermal shocks, the applied mechanical loads and the environment. In the work reported here it is shown that thermal shock cracks will arrest if the above-mentioned factors are below certain limits. This work seeks to determine the relevant levels of those factors. This paper presents an analysis of the crack growth mechanisms involved, including an assessment of the environmental effects. Proposals are presented as to the guidelines which might be used for design and operation of vessels to prevent the initiation of thermal shock cracking. The guidelines presented here are much more flexible than the highly restrictive guidelines published by EPRI in 1989 for economiser headers. The work also includes a study of the nature of crack growth. Most of the cracks are found to grow in conditions leading to arrest. This presents the possibility of fitness for purpose assessment of the cracking when it is found in service

Additional details

Identifiers

DOI
10.1016/j.ijpvp.2003.11.007;
PII
S0308016103001984;

Publishing Information

Journal Title
International Journal of Pressure Vessels and Piping
Journal Volume
81
Journal Issue
2
Journal Page Range
p. 173-180
ISSN
0308-0161
CODEN
PRVPAS

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
36085786
Subject category
S42: ENGINEERING;
Descriptors DEI
CARBON STEELS; CRACK PROPAGATION; CRACKS; DAMAGE; PRESSURE TUBES; PRESSURE VESSELS; THERMAL SHOCK
Descriptors DEC
ALLOYS; CARBON ADDITIONS; CONTAINERS; IRON ALLOYS; IRON BASE ALLOYS; STEELS; TRANSITION ELEMENT ALLOYS; TUBES

Optional Information

Copyright
Copyright (c) 2004 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.