Published July 2021 | Version v1
Journal article

Dependence of exchange bias and coercive field on Cu spacer thickness in oblique deposited Co/Cu/CoO multilayers

  • 1. Department of Physics, Gebze Technical University, 41400 Gebze, Kocaeli (Turkey)
  • 2. Department of Physics, Faculty of Arts and Science, Siirt University, 56100 Siirt (Turkey)
  • 3. Carnegie Mellon University, In Association with the Committee on Human Rights of the National Academy of Sciences, National Academy of Engineering, and National Academy of Medicine, Distance Fellows Program, Pittsburgh, PA 15213 (United States)

Description

Effect of growth-induced uniaxial anisotropy and thickness of non-magnetic Cu spacer between the ferromagnetic/antiferromagnetic Co/CoO multilayers on the exchange bias, coercive field, and magnetic anisotropy have been studied in 10–300 K temperature range. Co(8 nm)/Cu(tCu)/CoO(4 nm) (tCu = 0.6–2.6 nm) multilayers on Si (1 0 0) substrates were prepared using the oblique-angle magnetron sputtering deposition to induce growth induced magnetic anisotropy. The top Co layer was allowed to be naturally oxidized to obtain antiferromagnetic CoO. The films show a strong uniaxial in-plane anisotropy determined by ferromagnetic resonance measurements. Magnetization measurements for both easy and hard magnetization directions revealed that the exchange bias and coercive fields decrease by increasing Cu thickness. The existence of strong exchange bias across the thickest Cu layer shows the long-range character of exchange and dipolar interactions at 10 K. Dependence of Cu spacer thickness shows an oscillatory behavior that can be ascribed to the competitions between Ruderman–Kittel–Kasuya–Yosida (RKKY) and dipolar interactions.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.jmmm.2021.167926

Additional details

Identifiers

DOI
10.1016/j.jmmm.2021.167926;
PII
S030488532100202X;

Publishing Information

Journal Title
Journal of Magnetism and Magnetic Materials
Journal Volume
530
Journal Page Range
vp.
ISSN
0304-8853
CODEN
JMMMDC

Optional Information

Copyright
Copyright (c) 2021 Elsevier B.V. All rights reserved.