Published June 4, 2007 | Version v1
Journal article

Enhanced oxygen exchange near the oxide/silicon interface during silicon thermal oxidation

  • 1. NTT Basic Research Laboratories, NTT Corporation, 3-1 Morinosato-Wakamiya, Atsugi 243-0198 (Japan)
  • 2. Keio University and CREST-JST, 3-14-1 Hiyoshi, Kohoku-ku, Yokohama 223-8522 (Japan)

Description

The effect of the SiO2/Si interface on oxygen exchange diffusion during oxidation was investigated using oxygen isotopes. A 40-nm thick Si18O2 layer was first grown in 18O2 and then the sample was reoxidized in 16O2 at 1100 deg. C. The 18O diffusion in Si16O2 during the 16O2 oxidation was investigated by secondary ion mass spectrometry measurements. A significant broadening of the 18O profile toward the newly grown Si16O2 was observed. The average oxygen diffusivity was initially about one order of magnitude larger than the reported thermal diffusivity in the SiO2 network. In addition, the 18O diffusion became slower with oxidation time and hence with increasing distance between 18O diffusion region and the interface. This distance-dependent 18O self-diffusion was simulated taking into account the effect of Si16O molecules generated at the interface upon oxidation and diffusing into SiO2 to enhance the oxygen exchange. The simulation fits the SIMS profiles and shows that the SiO diffusion is greatly retarded by the oxidation with O2 from the oxygen-containing atmosphere. Therefore, the Si16O concentration becomes smaller as the interface leaves the 18O region and the oxygen exchange becomes slower with time

Additional details

Identifiers

DOI
10.1016/j.tsf.2006.11.052;
PII
S0040-6090(06)01406-4;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
515
Journal Issue
16
Journal Page Range
p. 6596-6600
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
EMRS 2006 Symposium J on synthesis processing and characterization of nanoscale functional oxide films
Dates
29 May - 2 Jun 2006
Place
Nice (France)

Optional Information

Copyright
Copyright (c) 2006 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.