Metrology of image placement

Metrology of registration, overlay and alignment offset in microlithography are discussed. Requirements and limitations are traced to the device ground rules and the definitions of edge, linewidth and centerline. Precision, accuracy, system performance and metrology in applications are discussed. The impact of image acquisition and data handling on performance is elucidated. Much attention is given to the manufacturing environment and effects of processing. General new methods of metrology error diagnostics and technology characterization are introduced and illustrated. Applications of these diagnostics to tests of tool performance, error diagnostics and culling, as well as to process integration in manufacturing are described. Realistic overlay reference materials and results of accuracy evaluations are discussed. Requirements in primary standards and alternative metrology are explained. The role and capability of SEM based overlay metrology is described, along with applications to device overlay metrology