High dual-aging-resistant property obtained in silica fume filled epoxy based composite and its lifetime prediction by aging model

Strong aging resistant epoxy based composite sealants have attracted wide attention in the field of the high electric insulating electronic packaging. However, the aging mechanism of the sealants is very complex and the practical lifetime prediction for them has hardly been reported. In order to evaluate the aging lifetime of composite sealant more practically, in this work, the composite sealant consisting of epoxy resin and silica fume has been prepared and its service lifetime under heat-oxygen/electric field co-aging has been studied based on the Arrhenius aging model. The fine aging-resistant mechanical and electric insulating properties have been found for the as-prepared sealant and its lifetime has been predicted to be 23 years at 30 °C of heat-oxygen aging. The aging mainly originates from the heat-oxygen aging rather than electric field aging for this sealant. This work might open the door to the large-scale fabrication of high-performance epoxy based composite sealants with robust aging-resistant property as well as to the practical lifetime prediction for the sealants based on Arrhenius aging model. (paper)