Published 2006
| Version v1
Journal article
Quantitative Definition of Thin Metal Films Adhesion with Glass
- 1. NSC 'Kharkov Institute of Physics and Technology', Kharkov (Ukraine)
Description
The technique of quantitative definition of strength of adhesion thin copper films with a surface of glass substrates by a method of scratch is described. The copper coverings were deposited by a vacuum-arc method. It was shown, that in an interval of films thickness from ∼0,04 up to ∼0,2 μm the strength of adhesion was ∼ 40 MPa. With the further increase of thickness of the films up to ∼ 1 μm the strength of adhesion reduced down to ∼2 MPa
Additional details
Additional titles
- Original title (Russian)
- Количественное определение прочности сцепления тонких металлических пленок со стеклом
Publishing Information
- Journal Title
- Voprosy Atomnoj Nauki i Tekhniki. Fizika Radiatsionnykh Povrezhdenij i Radiatsionnoe Materialovedenie
- Journal Issue
- no.4/89
- Journal Page Range
- p. 221-223
- ISSN
- 0134-5400
- CODEN
- VAFMDP
INIS
- Country of Publication
- Ukraine
- Country of Input or Organization
- Ukraine
- INIS RN
- 38079597
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- ADHESION; COPPER; DEPOSITION; ELECTRIC ARCS; GLASS; SUBSTRATES; THICKNESS; THIN FILMS
- Descriptors DEC
- CURRENTS; DIMENSIONS; ELECTRIC CURRENTS; ELECTRIC DISCHARGES; ELEMENTS; FILMS; METALS; TRANSITION ELEMENTS