Published December 15, 2009 | Version v1
Journal article

TEM observations in Si: An attempt to link deformation microstructures and electrical activity

  • 1. PHYMAT, UMR 6630 CNRS-Universite de Poitiers, SP2MI, F-86960 Chasseneuil-Futuroscope (France)
  • 2. Institute of Microelectronics Technology, RAS, 142432 Chernogolovka, Moscow District (Russian Federation)

Description

The deformation microstructures of Si single crystals have been studied by transmission electron microscopy (TEM) in the temperature range of deformation where 'dislocation trails' are evidenced. The main features of the deformation microstructures are characterized by dislocations dipoles and their debris. These microscopic observations are discussed in relation with the mesoscopic properties of dislocation trails as well as the possible transformation between two different core structures of dislocations in silicon.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.physb.2009.08.134

Additional details

Identifiers

DOI
10.1016/j.physb.2009.08.134;
PII
S0921-4526(09)00889-8;

Publishing Information

Journal Title
Physica. B, Condensed Matter
Journal Volume
404
Journal Issue
23-24
Journal Page Range
p. 4634-4636
ISSN
0921-4526
CODEN
PHYBE3

Conference

Title
25. international conference on defects in semiconductors
Dates
20-24 Jul 2009
Place
St. Petersburg (Russian Federation)

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
41089616
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Resource subtype / Literary indicator
Conference
Descriptors DEI
CRYSTAL DEFECTS; DEFORMATION; DIPOLES; DISLOCATIONS; MICROSTRUCTURE; MONOCRYSTALS; SILICON; TRANSMISSION ELECTRON MICROSCOPY
Descriptors DEC
CRYSTAL DEFECTS; CRYSTAL STRUCTURE; CRYSTALS; ELECTRON MICROSCOPY; ELEMENTS; LINE DEFECTS; MICROSCOPY; MULTIPOLES; SEMIMETALS

Optional Information

Copyright
Copyright (c) 2009 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.