An introduction to closed field sputtering (CFS) equipment

Ways have been sought to develop the vacuum sputtering process to reduce the source material temperature and to increase the deposition rate. A new industrial plating method superior to vacuum evaporation and electroplating has emerged. In this 'closed field sputtering' processes an electric field is applied between a coaxial anode and cathode and a magnetic field applied orthogonally to the electric field. Providing the flux density of the magnetic field is above a critical value no electrons flow to the anode but move along the magnetic lines around the cathode, enclosed in the magnetic field. A high density electron cloud with high ionization probability is therefore maintained. Low temperature sputtering can be attained due to very low energy loss of electrons at the anode. A pressure of about (2-5) x 10(-4) torr is used. High power can be applied to the equipment without producing much heat. It enables a large number of plastic parts to be coated with almost any nonmagnetic metal and alloys of metals on a commercial basis. It is also possible to produce coatings of oxides. nitrides and carbides of metals. The method of operation and a description of the equipment are given. Applications include car exteriors, household appliances, furniture toys and the electronics industry. (UK)