Published October 2008 | Version v1
Journal article

XPS studies on passive film formed on stainless steel in a high-temperature and high-pressure methanol solution containing chloride ions

  • 1. Kimura Chemical Plants Co. Ltd., 2-1-2, Kuise-Terajima, Amagasaki, Hyogo 660-8567 (Japan)
  • 2. Graduate School of Engineering, University of Hyogo, 2167 Shosha, Himeji, Hyogo 671-2280 (Japan)
  • 3. Hyogo Prefectural Institute of Technology, 3-1-12 Yukihira, Suma, Kobe 654-0037 (Japan)

Description

The composition and structure of passive film formed on 316L SS immersed in an anhydrous methanol solution (water content < 0.05 wt%) containing 0.42 wt% LiCl at 323-473 K were investigated by X-ray photoelectron spectroscopy (XPS), and compared with those of film formed in an aqueous solution. The passive film formed in the methanol solution was mainly composed of Fe and Cr oxides, and it possessed a double-layered structure consisting of an Fe oxide-rich outer layer and a Cr oxide-rich inner layer. Dissolution of the Fe-rich layer and densification of the Cr-rich inner layer were observed, especially at high temperatures. However, these were suppressed in an aerated methanol solution at 423 K or below, probably due to the barrier effect of adsorbed oxygen. No Ni compound contributed to composing the passive film, even at higher temperatures. The ratio of OH- to O2- was small and decreased with an increase in temperature (the presence of oxygen suppressed the decrease, especially at 423 K or below). The chloride ions were concentrated in the Fe-rich outer layer, and they penetrated more deeply than that in the aqueous solution into the passive film formed in the methanol solution

Availability note (English)

Available from http://dx.doi.org/10.1016/j.corsci.2008.07.006

Additional details

Identifiers

DOI
10.1016/j.corsci.2008.07.006;
PII
S0010-938X(08)00275-8;

Publishing Information

Journal Title
Corrosion Science
Journal Volume
50
Journal Issue
10
Journal Page Range
p. 2840-2845
ISSN
0010-938X
CODEN
CRRSAA

Optional Information

Copyright
Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.