Production of lead microcones by contamination lithography

For the production of lead microcones with defined positions on lead substrates the method of contamination lithography was found to be applicable. After deposition of three-dimensional contaminants in a SEM the sample surfaces were exposed to perpendicular Ar+-ion bombardment. Lead microcones with an apex angle of 200 and a tip radius of 150 nm have been produced. Some applications, especially integration in thin film devices as point contacts, should be possible. (author)