Published August 2013
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Fundamental study on metal plating removal using pulsed power technology
- 1. Kyushu Sangyo University, Department of Electrical Engineering and Information Technology, Fukuoka (Japan)
- 2. Kumamoto University, Graduate School of Science and Technology, Kumamoto (Japan)
Description
A novel method for the metal removal from metal-plated substrate using pulsed power technology is proposed. A metal-plated substrate with three metal-layers structure (Cu, Ni and Au) is used as the sample substrate. Repetitive pulsed arc discharge plasma is generated between a rod electrode and the surface of substrate. Effect of the type of electrode system on metal plating removal was investigated. The removal region is produced by the moving phenomena of the pulsed arc discharge. A part of Au layer, which is the tompost metal surface of the substrate is vaporized and removed by the repetitive pulsed arc discharges. The proposed method can be used for recycle of metal-plated substrate. (author)
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Additional details
Publishing Information
- Imprint Title
- Physics and application of plasmas based on pulsed power technology
- Imprint Pagination
- 119 p.
- Journal Page Range
- p. 107-111
- Report number
- NIFS-PROC--93
Conference
- Title
- Physics and application of plasmas based on pulsed power technology
- Dates
- 10-11 Jan 2013
- Place
- Toki, Gifu (Japan)
INIS
- Country of Publication
- Japan
- Country of Input or Organization
- Japan
- INIS RN
- 48037623
- Subject category
- S37: INORGANIC, ORGANIC, PHYSICAL AND ANALYTICAL CHEMISTRY;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ELECTRIC ARCS; ELECTRIC IMPEDANCE; ELECTRIC POTENTIAL; ELECTRODES; GOLD; NICKEL; PLASMA; PLATING; POWER GENERATION; PULSE GENERATORS; REMOVAL
- Descriptors DEC
- CURRENTS; DEPOSITION; ELECTRIC CURRENTS; ELECTRIC DISCHARGES; ELECTRONIC EQUIPMENT; ELEMENTS; EQUIPMENT; FUNCTION GENERATORS; IMPEDANCE; METALS; SURFACE COATING; TRANSITION ELEMENTS
Optional Information
- Notes
- 3 refs., 7 figs., 1 tab.