Published August 2013 | Version v1
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Fundamental study on metal plating removal using pulsed power technology

  • 1. Kyushu Sangyo University, Department of Electrical Engineering and Information Technology, Fukuoka (Japan)
  • 2. Kumamoto University, Graduate School of Science and Technology, Kumamoto (Japan)

Description

A novel method for the metal removal from metal-plated substrate using pulsed power technology is proposed. A metal-plated substrate with three metal-layers structure (Cu, Ni and Au) is used as the sample substrate. Repetitive pulsed arc discharge plasma is generated between a rod electrode and the surface of substrate. Effect of the type of electrode system on metal plating removal was investigated. The removal region is produced by the moving phenomena of the pulsed arc discharge. A part of Au layer, which is the tompost metal surface of the substrate is vaporized and removed by the repetitive pulsed arc discharges. The proposed method can be used for recycle of metal-plated substrate. (author)

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Part of:
Physics and application of plasmas based on pulsed power technology

Additional details

Publishing Information

Imprint Title
Physics and application of plasmas based on pulsed power technology
Imprint Pagination
119 p.
Journal Page Range
p. 107-111
Report number
NIFS-PROC--93

Conference

Title
Physics and application of plasmas based on pulsed power technology
Dates
10-11 Jan 2013
Place
Toki, Gifu (Japan)

Optional Information

Notes
3 refs., 7 figs., 1 tab.