Published 2001 | Version v1
Miscellaneous Metadata-only

Characteristics of creep crack growth in pure copper at elevated temperature

Creators

  • 1. Korea Research Institute of Standards and Science, Taejon (Korea, Republic of)
  • 2. Kongju National Univ., Kongju (Korea, Republic of)
  • 3. Kyungpook National Univ., Daeju (Korea, Republic of)

Description

The significant creep in copper takes place at relatively low temperature and applied stress. Thus the study on modeling of creep behavior using the copper should provide researchers with benefits such as time for the test. In this study, a test of creep crack growth regrading copper was performed at 400 and 500 .deg. C, and analyzed. As results, the crack growth rate at 500 .deg. C turned out to be 10 times higher than that at 400 .deg. C in terms of C*, while the crack growth rate at 500 .deg. C was several hundreds times higher than that at 400 .deg. C in terms of K. Moreover, a linear relationship between the crack growth rate and C* at the same temperature was established

Part of:
Proceedings of the KSME 2001 spring annual meeting A

Additional details

Publishing Information

Publisher
KSME
Imprint Place
Seoul (Korea, Republic of)
Imprint Title
Proceedings of the KSME 2001 spring annual meeting A
Imprint Pagination
980 p.
Journal Page Range
p. 495-500

Conference

Title
KSME 2001 spring annual meeting A
Dates
27-29 Jun 2001
Place
Cheju (Korea, Republic of)

INIS

Country of Publication
Korea, Republic of
Country of Input or Organization
Korea, Republic of
INIS RN
36017204
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference, Non-conventional Literature
Descriptors DEI
ANTIMONY; COPPER; CRACKS; CREEP; ELECTRIC POTENTIAL; GROWTH; STRESS INTENSITY FACTORS; TENSILE PROPERTIES
Descriptors DEC
ELEMENTS; MECHANICAL PROPERTIES; METALS; TRANSITION ELEMENTS

Optional Information

Notes
15 refs, 7 figs, 1 tab