Published June 2009 | Version v1
Journal article

Thermal conductivity measurement of HTS tapes and stacks for current lead applications

  • 1. Institute for Technical Physics, Forschungszentrum Karlsruhe, D-76021 Karlsruhe (Germany)

Description

The use of high-temperature-superconductors (HTS) within current leads offers a high potential to save cooling-power. The principle of HTS current leads is well established, e.g. for particle accelerators (LHC-CERN) but also on the commercial sector, which offer HTS current leads ready for use in small scale magnets and magnets systems. Future fusion machines currently under construction like ITER, W7-X or JT-60SA also will use HTS current leads. At the moment the standard material for HTS current leads is a Bi2Sr2Ca2Cu3Ox (BSCCO)-AgAu composite tape. The common way to receive high current capacity current leads is to form stacks by sintering or soldering these tapes together. The solder changes the thermal conductivity of the stacks compared to the single tape in the temperature range from 4 K to 60 K. To estimate the heat flux from the warm environment to the cold application the measurement of the thermal conductivity of the soldered stack is mandatory. Therefore the thermal conductivity of stacks with different number of tapes is investigated. To measure the thermal conduction in the current flow direction, the axial heat flow method is used. Combining these results with FEM simulations gives the possibility to estimate the thermal conductivity normal to the flat tape plane. The resulting anisotropic thermal conductivity can be used to model the behaviour of the HTS tape under thermal disturbances more accurately.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.fusengdes.2008.11.031

Additional details

Identifiers

DOI
10.1016/j.fusengdes.2008.11.031;
PII
S0920-3796(08)00386-4;

Publishing Information

Journal Title
Fusion Engineering and Design
Journal Volume
84
Journal Issue
7-11
Journal Page Range
p. 1748-1750
ISSN
0920-3796
CODEN
FEDEEE

Conference

Title
25. symposium on fusion technology
Acronym
SOFT-25
Dates
15-19 Sep 2008
Place
Rostock (Germany)

INIS

Optional Information

Copyright
Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.