Published February 1, 2005 | Version v1
Journal article Metadata-only

Improved adhesion of Au thin films to SiOx/Si substrates by dendrimer mediation

Creators

  • 1. Center for Materials for Information Technology, University of Alabama, 205 Bevill Building, Tuscaloosa, AL 35487-0209 (United States)
  • 2. Department of Chemistry, University of Alabama, 133 Lloyd Hall, Tuscaloosa, AL 35487-0336 (United States)
  • 3. Center for Materials for Information Technology, University of Alabama, 205 Bevill Building, Tuscaloosa, AL 35487-0209 (United States) and Department of Metallurgical and Materials Engineering, University of Alabama, A129 Bevill Building, Tuscaloosa, AL 35487-0202 (United States)

Description

Quantitative evidence of significantly improved interfacial adhesion between Au films and SiOx/Si substrates induced by an organic dendrimer monolayer was presented. For dendrimer-mediated Au films, nanoscratch tests revealed a critical load that was two times higher than that for films without dendrimer mediation. Atomic force microscopy (AFM) examination of nanoindents revealed much constrained lateral flow of metals in the dendrimer-mediated Au films during nanoindentation, indicating enhanced adhesion due to the presence of the dendrimer layer

Additional details

Identifiers

DOI
10.1016/j.tsf.2004.07.080;
PII
S0040-6090(04)01087-9;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
473
Journal Issue
1
Journal Page Range
p. 164-168
ISSN
0040-6090
CODEN
THSFAP

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
36112463
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
ADHESION; ATOMIC FORCE MICROSCOPY; LAYERS; SILICON; SILICON OXIDES; SUBSTRATES; THIN FILMS
Descriptors DEC
CHALCOGENIDES; ELEMENTS; FILMS; MICROSCOPY; OXIDES; OXYGEN COMPOUNDS; SEMIMETALS; SILICON COMPOUNDS

Optional Information

Copyright
Copyright (c) 2004 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.