Published September 26, 2007 | Version v1
Journal article

Ultra Low-κ Metrology Using X-Ray Reflectivity And Small-Angle X-Ray Scattering Techniques

  • 1. Freescale Semiconductor, STMicroelectronics, 850, rue Jean Monnet, 38926 Crolles (France)
  • 2. STMicroelectronics, 850, rue Jean Monnet, 38926 Crolles (France)
  • 3. Jordan Valley, Zone 6 Ramat Graviel, Industrial zone, Migdal Ha'Emek 23100 (Israel)
  • 4. CEA/LETI-MINATEC, 17 rue des martyrs, 38000 Grenoble (France)

Description

The automated metrology tool, combining X-ray reflectivity XRR and small-angle X-ray scattering SAXS has been demonstrated as a capable equipment to assess standard porous Ultra low-κ (ULK) metrology. Therefore those techniques have enabled characterizations of several ULK used in sub-65 nm nodes integration. Standard ULK material for 65 nm node technology has been monitored through the whole C065 integration steps using those combined techniques

Additional details

Identifiers

Publishing Information

Journal Title
AIP Conference Proceedings
Journal Volume
931
Journal Issue
1
Journal Page Range
p. 347-351
ISSN
0094-243X
CODEN
APCPCS

Conference

Title
2007 international conference on frontiers of characterization and metrology
Dates
27-29 Mar 2007
Place
Gaithersburg, MD (United States)

INIS

Country of Publication
United States
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
39052929
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
POROUS MATERIALS; REFLECTION; REFLECTIVITY; SMALL ANGLE SCATTERING; X-RAY DIFFRACTION
Descriptors DEC
COHERENT SCATTERING; DIFFRACTION; MATERIALS; OPTICAL PROPERTIES; PHYSICAL PROPERTIES; SCATTERING; SURFACE PROPERTIES

Optional Information

Notes
(c) 2007 American Institute of Physics