A novel fabrication process to realize a valveless micropump on a flexible substrate
- 1. Electronics and Computer Science, University of Southampton, Southampton (United Kingdom)
Description
This paper reports, for the first time, on the design, fabrication and testing of a planar valveless micropump, entirely screen printed onto a flexible polyimide (Kapton) substrate using sacrificial, structural, conductive and piezoelectric layers. The sacrificial layer, used to achieve a pump chamber and inlet/outlet channels, is removed using water followed by a 140 ° C heat treatment to evaporate the water from the structure. The fabrication process is analogous to a standard silicon based micro-electro-mechanical system sacrificial process. Applying a sinusoidal AC voltage to the piezoelectric layer drives a flexible membrane which pumps a liquid through the chamber. A maximum flow rate of 38 μl min−1 was achieved using a drive frequency of 3 kHz. (paper)
Availability note (English)
Available from http://dx.doi.org/10.1088/0964-1726/23/2/025034Additional details
Identifiers
Publishing Information
- Journal Title
- Smart Materials and Structures (Print)
- Journal Volume
- 23
- Journal Issue
- 2
- Journal Page Range
- [8 p.]
- ISSN
- 0964-1726
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 47046689
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- ELECTRIC POTENTIAL; FABRICATION; FLOW RATE; HEAT TREATMENTS; KHZ RANGE; LAYERS; MEMBRANES; MEMS; MICROSTRUCTURE; PIEZOELECTRICITY; PUMPS; SILICON; SUBSTRATES; TESTING; WATER
- Descriptors DEC
- ELECTRICITY; ELEMENTS; EQUIPMENT; FREQUENCY RANGE; HYDROGEN COMPOUNDS; OXYGEN COMPOUNDS; SEMIMETALS