Published February 2014 | Version v1
Journal article

A novel fabrication process to realize a valveless micropump on a flexible substrate

  • 1. Electronics and Computer Science, University of Southampton, Southampton (United Kingdom)

Description

This paper reports, for the first time, on the design, fabrication and testing of a planar valveless micropump, entirely screen printed onto a flexible polyimide (Kapton) substrate using sacrificial, structural, conductive and piezoelectric layers. The sacrificial layer, used to achieve a pump chamber and inlet/outlet channels, is removed using water followed by a 140 ° C heat treatment to evaporate the water from the structure. The fabrication process is analogous to a standard silicon based micro-electro-mechanical system sacrificial process. Applying a sinusoidal AC voltage to the piezoelectric layer drives a flexible membrane which pumps a liquid through the chamber. A maximum flow rate of 38 μl min−1 was achieved using a drive frequency of 3 kHz. (paper)

Availability note (English)

Available from http://dx.doi.org/10.1088/0964-1726/23/2/025034

Additional details

Publishing Information

Journal Title
Smart Materials and Structures (Print)
Journal Volume
23
Journal Issue
2
Journal Page Range
[8 p.]
ISSN
0964-1726

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
47046689
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
ELECTRIC POTENTIAL; FABRICATION; FLOW RATE; HEAT TREATMENTS; KHZ RANGE; LAYERS; MEMBRANES; MEMS; MICROSTRUCTURE; PIEZOELECTRICITY; PUMPS; SILICON; SUBSTRATES; TESTING; WATER
Descriptors DEC
ELECTRICITY; ELEMENTS; EQUIPMENT; FREQUENCY RANGE; HYDROGEN COMPOUNDS; OXYGEN COMPOUNDS; SEMIMETALS