A novel sandwich differential capacitive accelerometer with symmetrical double-sided serpentine beam-mass structure

This paper presents a novel differential capacitive silicon micro-accelerometer with symmetrical double-sided serpentine beam-mass sensing structure and glass–silicon–glass sandwich structure. The symmetrical double-sided serpentine beam-mass sensing structure is fabricated with a novel pre-buried mask fabrication technology, which is convenient for manufacturing multi-layer sensors. The glass–silicon–glass sandwich structure is realized by a double anodic bonding process. To solve the problem of the difficulty of leading out signals from the top and bottom layer simultaneously in the sandwich sensors, a silicon pillar structure is designed that is inherently simple and low-cost. The prototype is fabricated and tested. It has low noise performance (the peak to peak value is 40 μg) and μg-level Allan deviation of bias (2.2 μg in 1 h), experimentally demonstrating the effectiveness of the design and the novel fabrication technology. (paper)