Published December 1, 2008 | Version v1
Journal article

Water adsorption on fullerene-like carbon nitride overcoats

  • 1. Department of Chemical Engineering, Carnegie Mellon University, Pittsburgh, PA 15213 (United States)
  • 2. IFM, Linkoeping University, SE 581-83 Linkoeping (Sweden)

Description

Humidity influences the tribological performance of the head-disk interface in magnetic data storage devices. In this work we compare the uptake of water of amorphous carbon nitride (a-CNx) films, widely used as protective overcoats in computer disk drive systems, with fullerene-like carbon nitride (FL-CNx) and amorphous carbon (a-C) films. Films with thickness in the range 10-300 nm were deposited on quartz crystal substrates by reactive DC magnetron sputtering. A quartz crystal microbalance placed in a vacuum chamber was used to measure the water adsorption. Electron paramagnetic resonance (EPR) has been used to correlate water adsorption with film microstructure and surface defects (dangling bonds). Measurements indicate that the amount of adsorbed water is highest for the pure a-C films and that the FL-CNx films adsorbed less than a-CNx. EPR data correlate the lower water adsorption on FL-CNx films with a possible lack of dangling bonds on the film surface. To provide additional insight into the atomic structure of defects in the FL-CNx, a-CNx and a-C compounds, we performed first-principles calculations within the framework of Density Functional Theory. Emphasis was put on the energy cost for formation of vacancy defects and dangling bonds in relaxed systems. Cohesive energy comparison reveals that the energy cost formation for dangling bonds in different configurations is considerably higher in FL-CNx than for the amorphous films. These simulations thus confirm the experimental results showing that dangling bonds are much less likely in FL-CNx than in a-CNx and a-C films

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2008.07.022

Additional details

Identifiers

DOI
10.1016/j.tsf.2008.07.022;
PII
S0040-6090(08)00769-4;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
517
Journal Issue
3
Journal Page Range
p. 1106-1110
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
35. international conference on metallurgical coatings and thin films (ICMCTF)
Dates
28 Apr - 2 May 2008
Place
San Diego, CA (United States)

Optional Information

Copyright
Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.