Published April 30, 2017 | Version v1
Journal article

Effective inelastic scattering cross-sections for background analysis in HAXPES of deeply buried layers

  • 1. Department of Physics, Chemistry and Pharmacy, University of Southern Denmark, DK-5230 Odense M (Denmark)
  • 2. Université de Lyon, Institut des Nanotechnologies de Lyon, 36 avenue Guy de Collongue, 69134 Ecully (France)
  • 3. CEA, LETI, MINATEC Campus, F-38054 Grenoble (France)
  • 4. Univ. Grenoble Alpes, F-38000 Grenoble (France)
  • 5. Sorbonne Universités, UPMC Univ. Paris 06, CNRS, UMR 7614, Laboratoire de Chimie Physique-Matière et Rayonnement, F-75005, Paris (France)
  • 6. Synchrotron SOLEIL, L'Orme des Merisiers Saint-Aubin, BP 48 91192, Gif-sur-Yvette Cedex (France)

Description

Highlights: • An effective approach for quantitative background analysis in HAXPES spectra of buried layer underneath complex overlayer structures is proposed. • The approach relies on using a weighted sum of inelastic scattering cross section of the pure layers. • The method is validated by the study of an advanced power transistor stack after successive annealing steps. • The depth distribution of crucial elements (Ti, Ga) is determined reliably at depths up to nearly 50 nm. - Abstract: Inelastic background analysis of HAXPES spectra was recently introduced as a powerful method to get access to the elemental distribution in deeply buried layers or interfaces, at depth up to 60 nm below the surface. However the accuracy of the analysis highly relies on suitable scattering cross-sections able to describe effectively the transport of photoelectrons through overlayer structures consisting of individual layers with potentially very different scattering properties. Here, we show that within Tougaard's practical framework as implemented in the Quases-Analyze software, the photoelectron transport through thick (25–40 nm) multi-layer structures with widely different cross-sections can be reliably described with an effective cross-section in the form of a weighted sum of the individual cross-section of each layer. The high-resolution core-level analysis partly provides a guide for determining the nature of the individual cross-sections to be used. We illustrate this novel approach with the practical case of a top Al/Ti bilayer structure in an AlGaN/GaN power transistor device stack before and after sucessive annealing treatments. The analysis provides reliable insights on the Ti and Ga depth distributions up to nearly 50 nm below the surface.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.apsusc.2017.01.046

Additional details

Identifiers

DOI
10.1016/j.apsusc.2017.01.046;
PII
S0169-4332(17)30046-6;

Publishing Information

Journal Title
Applied Surface Science
Journal Volume
402
Journal Page Range
p. 78-85
ISSN
0169-4332
CODEN
ASUSEE

Optional Information

Copyright
Copyright (c) 2017 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.