Published March 1985 | Version v1
Report

Stress effects of Raman line position during pulsed-laser annealing

  • 1. Oak Ridge National Lab., TN

Description

It has been found that when a uniaxial tensile stress is applied to silicon, the optical phonon shifts its frequency and splits into a singlet and a doublet. Both the shift and the splitting are found to be proportional to the applied stress. The authors have performed a calculation to determine the phonon frequency shift and splitting for the case of pulsed-laser-annealed silicon. The results are shown for <100> silicon in and for <111> silicon

Additional details

Publishing Information

Imprint Title
Solid State Division progress report for period ending September 30, 1984
Journal Page Range
p. 119-120.
Report number
ORNL--6128

INIS

Country of Publication
United States
Country of Input or Organization
United States
INIS RN
18001719
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
ANNEALING; LASER RADIATION; PHONONS; PHYSICAL RADIATION EFFECTS; RAMAN EFFECT; SILICON; STRESSES
Descriptors DEC
ELECTROMAGNETIC RADIATION; ELEMENTS; HEAT TREATMENTS; QUASI PARTICLES; RADIATION EFFECTS; RADIATIONS; SEMIMETALS