Published July 15, 2006 | Version v1
Journal article

Effect of an absorbent overlay on the residual stress field induced by laser shock processing on aluminum samples

  • 1. Centro de Ingenieria y Desarrollo Industrial, Pie de la Cuesta No. 702, Desarrollo San Pablo, Queretaro, Qro. 76130 (Mexico)
  • 2. Departamento de Ciencias Exactas y Tecnologicas, Centro Universitario de los Lagos, Universidad de Guadalajara. Lagos de Moreno Jal. (Mexico)
  • 3. Departamento de Fisica Aplicada a la Ingenieria Industrial, E.T.S.I.I. Universidad Politecnica de Madrid (Spain)

Description

Laser shock processing (LSP) or laser shock peening is a new technique for strengthening metals. This process induces a compressive residual stress field, which increases fatigue crack initiation life and reduces fatigue crack growth rate. Specimens of 6061-T6 aluminum alloy are used in this investigation. A convergent lens is used to deliver 2.5 J, 8 ns laser pulses by a Q-switch Nd:YAG laser, operating at 10 Hz. The pulses are focused to a diameter of 1.5 mm onto aluminum samples. Density of 2500 pulses/cm2 with infrared (1064 nm) radiation was used. The effect of an absorbent overlay on the residual stress field using this LSP setup and this energy level is evaluated. Residual stress distribution as a function of depth is assessed by the hole drilling method. It is observed that the overlay makes the compressive residual stress profile move to the surface. This effect is explained on the basis of the vaporization of the coat layer suppressing thermal effects on the metallic substrate. The effect of coating the specimen surface before LSP treatment may have advantages on improving wear and contact fatigue properties of this aluminum alloy

Additional details

Identifiers

DOI
10.1016/j.apsusc.2005.08.062;
PII
S0169-4332(05)01110-4;

Publishing Information

Journal Title
Applied Surface Science
Journal Volume
252
Journal Issue
18
Journal Page Range
p. 6201-6205
ISSN
0169-4332
CODEN
ASUSEE

Optional Information

Copyright
Copyright (c) 2005 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.