Published November 1976
| Version v1
Journal article
Composition analysis of tin/lead platings on printed circuit boards by the beta-backscatter method
Description
A beta-backscatter gauge for composition analysis of tin/lead plating is described. The gauge utilizes 63Ni which emits low energy beta-particles. The average tin content of a 1 micron thick surface layer is determined to an accuracy of 2% tin during a 2-min counting sequence. A composition depth-profile analysis of tin/lead platings on printed circuit boards is carried out by repeated lappings and backscatter measurements. This procedure has in some cases revealed a non-homogeneous structure of the platings. (author)
Additional details
Identifiers
Publishing Information
- Journal Title
- The International Journal of Applied Radiation and Isotopes
- Journal Volume
- 27
- Journal Issue
- 11
- Series
- Int. J. Appl. Radiat. Isot.
- Journal Page Range
- 631-636
- ISSN
- 0020-708X
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- United Kingdom
- INIS RN
- 8300756
- Subject category
- S37: INORGANIC, ORGANIC, PHYSICAL AND ANALYTICAL CHEMISTRY;
- Descriptors DEI
- ACCURACY; DEPTH; KEV RANGE 10-100; LEAD; NICKEL 63; PLATING; PRINTED CIRCUITS; QUANTITATIVE CHEMICAL ANALYSIS; RADIOMETRIC GAGES; SPATIAL DISTRIBUTION; TIN
- Descriptors DEC
- BETA DECAY RADIOISOTOPES; BETA-MINUS DECAY RADIOISOTOPES; CHEMICAL ANALYSIS; DEPOSITION; DIMENSIONS; DISTRIBUTION; ELECTRONIC CIRCUITS; ELEMENTS; ENERGY RANGE; EVEN-ODD NUCLEI; INTERMEDIATE MASS NUCLEI; ISOTOPES; KEV RANGE; MEASURING INSTRUMENTS; METALS; NICKEL ISOTOPES; NUCLEI; RADIOISOTOPES; SURFACE COATING; YEARS LIVING RADIOISOTOPES
Optional Information
- Notes
- Updated automatically by Metadata and Full-Text Enrichment Agent