Published April 28, 1981 | Version v1
Patent

Sputtered particle flow source for isotopically selective ionization

Description

Method and apparatus are described for sputtering particles of plural isotope types to produce a particle flow of the plural isotope types into a region where laser radiation is generated to produce isotopically selective ionization of at least one isotope type in the sputtered particle flow. Separate collection of the ionized particles is accomplished through application of a magnetic field in the region of ionization and beyond

Availability note (English)

U.S. Commissioner of Patents, Washington, D.C. 20231, USA, $.50.

Additional details

Additional titles

Augmented title (English)
Patent

Publishing Information

Imprint Pagination
v p.
Patent number
US patent document 4,264,819/A/