Published April 12, 2010 | Version v1
Journal article

Origin of reverse annealing effect in hydrogen-implanted silicon

  • 1. Los Alamos National Laboratory, Los Alamos, New Mexico 87545 (United States)
  • 2. Silicon Technology Solutions, Freescale Semiconductor Inc., Tempe, Arizona 85284 (United States)

Description

In contradiction to conventional damage annealing, thermally annealed H-implanted Si exhibits an increase in damage or reverse annealing behavior, whose mechanism has remained elusive. In this work, we conclusively elucidate that the reverse annealing effect is due to the nucleation and growth of hydrogen-induced platelets. Platelets are responsible for an increase in the height and width of the channeling damage peak following increased isochronal anneals.

Additional details

Identifiers

Publishing Information

Journal Title
Applied Physics Letters
Journal Volume
96
Journal Issue
15
Journal Page Range
p. 154103-154103.3
ISSN
0003-6951
CODEN
APPLAB

INIS

Country of Publication
United States
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
41078598
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
ANNEALING; CRYSTAL GROWTH; HYDROGEN; ION IMPLANTATION; NUCLEATION; SEMICONDUCTOR MATERIALS; SILICON
Descriptors DEC
ELEMENTS; HEAT TREATMENTS; MATERIALS; NONMETALS; SEMIMETALS

Optional Information

Notes
(c) 2010 American Institute of Physics