Published April 12, 2010
| Version v1
Journal article
Origin of reverse annealing effect in hydrogen-implanted silicon
- 1. Los Alamos National Laboratory, Los Alamos, New Mexico 87545 (United States)
- 2. Silicon Technology Solutions, Freescale Semiconductor Inc., Tempe, Arizona 85284 (United States)
Description
In contradiction to conventional damage annealing, thermally annealed H-implanted Si exhibits an increase in damage or reverse annealing behavior, whose mechanism has remained elusive. In this work, we conclusively elucidate that the reverse annealing effect is due to the nucleation and growth of hydrogen-induced platelets. Platelets are responsible for an increase in the height and width of the channeling damage peak following increased isochronal anneals.
Additional details
Identifiers
- DOI
- 10.1063/1.3396987;
Publishing Information
- Journal Title
- Applied Physics Letters
- Journal Volume
- 96
- Journal Issue
- 15
- Journal Page Range
- p. 154103-154103.3
- ISSN
- 0003-6951
- CODEN
- APPLAB
INIS
- Country of Publication
- United States
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 41078598
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- ANNEALING; CRYSTAL GROWTH; HYDROGEN; ION IMPLANTATION; NUCLEATION; SEMICONDUCTOR MATERIALS; SILICON
- Descriptors DEC
- ELEMENTS; HEAT TREATMENTS; MATERIALS; NONMETALS; SEMIMETALS
Optional Information
- Notes
- (c) 2010 American Institute of Physics