Published January 1, 2010 | Version v1
Journal article

Multiscale simulation for epitaxial silicon carbide growth by chlorides route

  • 1. Dipartimento di Chimica, Materiali e Ingegneria Chimica 'Giulio Natta', Politecnico di Milano, via Mancinelli 7, 20131 Milano (Italy)
  • 2. CNR-IMM sezione di Catania, Stradale Primosole 50, 95121 Catania (Italy)

Description

A multiscale-multi-hierarchy approach, based on a succession of simplified models, was used to describe the deposition and the film morphology evolution during the epitaxial silicon carbide deposition in an industrial hot wall reactor. The attention was focused on the system involving chlorinated species because of its superior performances with respect the traditional silane/hydrocarbons process. The evolution of the crystalline structure (i.e., from poly to single) and of the surface roughness can be understood by simply comparing two characteristic times, like those inherent the surface diffusion and the matter supply to the surface. Two other characteristic times were introduced to describe through a kinetic Monte Carlo model the line defects formation.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2009.10.045

Additional details

Identifiers

DOI
10.1016/j.tsf.2009.10.045;
PII
S0040-6090(09)01688-5;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
518
Journal Issue
6
Journal Page Range
p. S6-S11
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
6. international conference on silicon epitaxy and heterostructures
Acronym
ICSI-6
Dates
17-22 May 2009
Place
Los Angeles, CA (United States)

Optional Information

Copyright
Copyright (c) 2009 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.