Published November 13, 2009 | Version v1
Journal article

Defect evolution and accompanied change of electrical properties during the GaN growth by metalorganic chemical vapor deposition

  • 1. State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, P.O. Box 912, Beijing 100083 (China)
  • 2. Suzhou Institute of Nano-tech and Nano-bionics, Chinese Academy of Sciences, Suzhou 215125 (China)

Description

The defect evolution and its correlation with electrical properties of GaN films grown by metalorganic chemical vapor deposition are investigated. It is found that the dislocation density decreases gradually during the growth process, and the dislocation reduction rate in the island coalescence process is especially rapid. The changes in electron mobility of GaN with the increase of growth time are mainly dependent on the dislocations acting as scattering centers. Furthermore, the variation of carrier concentration in GaN may be related with the point defects and their clusters. The quality of GaN could be improved by suitably increasing the film thickness.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.jallcom.2009.07.147

Additional details

Identifiers

DOI
10.1016/j.jallcom.2009.07.147;
PII
S0925-8388(09)01504-7;

Publishing Information

Journal Title
Journal of Alloys and Compounds
Journal Volume
487
Journal Issue
1-2
Journal Page Range
p. 400-403
ISSN
0925-8388
CODEN
JALCEU

Optional Information

Copyright
Copyright (c) 2009 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.