Published November 1, 2017 | Version v1
Journal article

Characterization of N-polar AlN in GaN/AlN/(Al,Ga)N heterostructures grown by metal-organic chemical vapor deposition

  • 1. Electrical and Computer Engineering and Materials Departments, University of California, Santa Barbara, CA 93106, United States of America (United States)
  • 2. Center for Nanophase Materials Science, Oak Ridge National Laboratory, Oak Ridge, TN 37831-6139, United States of America (United States)

Description

In GaN/(Al,Ga)N high-electron-mobility transistors (HEMT), AlN interlayer between GaN channel and AlGaN barrier suppresses alloy scattering and significantly improves the electron mobility of the two-dimensional electron gas. While high concentrations of gallium were previously observed in Al-polar AlN interlayers grown by metal-organic chemical vapor deposition, the N-polar AlN (Al x Ga1−x N) films examined by atom probe tomography in this study exhibited aluminum compositions (x) equal to or higher than 95% over a wide range of growth conditions. The also investigated AlN interlayer in a N-polar GaN/AlN/AlGaN/ S.I. GaN HEMT structure possessed a similarly high x content. (paper)

Availability note (English)

Available from http://dx.doi.org/10.1088/1361-6641/aa8b30

Additional details

Identifiers

Publishing Information

Journal Title
Semiconductor Science and Technology
Journal Volume
32
Journal Issue
11
Journal Page Range
[5 p.]
ISSN
0268-1242
CODEN
SSTEET