Published November 2006 | Version v1
Journal article

Real-time monitoring of charge accumulation during pulse-time-modulated plasma

  • 1. Institute of Fluid Science, Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai 980-8577 (Japan)

Description

The authors investigated real-time monitoring of charge accumulation during pulse-time-modulated plasma processes by using their developed on-wafer monitoring chip. The charge accumulation potential between the top surface and the bottom in a SiO2 contact structure was measured during pulse-time-modulated plasma exposure with an on-wafer monitoring device. In conventional plasma with rf bias, the electron shading effect could be clearly observed as the potential difference between the wafer surface and the contact-hole bottom. Conversely, the accumulated charge in the pulse-time-modulated operation was drastically decreased. Time-resolved electron and ion flows to the SiO2 contact hole were clarified by the on-wafer monitoring. Accordingly, it was confirmed that the on-wafer monitoring is a very effective tool for investigating the local charge accumulation in actual device structures

Additional details

Identifiers

Publishing Information

Journal Title
Journal of Vacuum Science and Technology. A, International Journal Devoted to Vacuum, Surfaces, and Films
Journal Volume
24
Journal Issue
6
Journal Page Range
p. 2172-2175
ISSN
1553-1813

INIS

Country of Publication
United States
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
38026795
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
BUILDUP; ELECTRONS; ETCHING; MONITORING; PLASMA; PROCESSING; PULSES; SILICON OXIDES; SURFACES; TIME RESOLUTION
Descriptors DEC
CHALCOGENIDES; ELEMENTARY PARTICLES; FERMIONS; LEPTONS; OXIDES; OXYGEN COMPOUNDS; RESOLUTION; SILICON COMPOUNDS; SURFACE FINISHING; TIMING PROPERTIES

Optional Information

Notes
(c) 2006 American Vacuum Society