Real-time monitoring of charge accumulation during pulse-time-modulated plasma
Creators
- 1. Institute of Fluid Science, Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai 980-8577 (Japan)
Description
The authors investigated real-time monitoring of charge accumulation during pulse-time-modulated plasma processes by using their developed on-wafer monitoring chip. The charge accumulation potential between the top surface and the bottom in a SiO2 contact structure was measured during pulse-time-modulated plasma exposure with an on-wafer monitoring device. In conventional plasma with rf bias, the electron shading effect could be clearly observed as the potential difference between the wafer surface and the contact-hole bottom. Conversely, the accumulated charge in the pulse-time-modulated operation was drastically decreased. Time-resolved electron and ion flows to the SiO2 contact hole were clarified by the on-wafer monitoring. Accordingly, it was confirmed that the on-wafer monitoring is a very effective tool for investigating the local charge accumulation in actual device structures
Additional details
Identifiers
- DOI
- 10.1116/1.2362724;
Publishing Information
- Journal Title
- Journal of Vacuum Science and Technology. A, International Journal Devoted to Vacuum, Surfaces, and Films
- Journal Volume
- 24
- Journal Issue
- 6
- Journal Page Range
- p. 2172-2175
- ISSN
- 1553-1813
INIS
- Country of Publication
- United States
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 38026795
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- BUILDUP; ELECTRONS; ETCHING; MONITORING; PLASMA; PROCESSING; PULSES; SILICON OXIDES; SURFACES; TIME RESOLUTION
- Descriptors DEC
- CHALCOGENIDES; ELEMENTARY PARTICLES; FERMIONS; LEPTONS; OXIDES; OXYGEN COMPOUNDS; RESOLUTION; SILICON COMPOUNDS; SURFACE FINISHING; TIMING PROPERTIES
Optional Information
- Notes
- (c) 2006 American Vacuum Society