High temperature creep of nickel under conditions of impurity grain boundary diffusion from the surface

Comparative studies on impact of diffusion fluxes of copper and silver atoms from the surface on the nickel high-temperature plastic deformation are carried out. It is established that by the nickel high-temperature plastic deformation under conditions of presence of copper and silver diffusion fluxes from the surface there takes place the effect of decreasing the nickel creep resistance, conditioned by increase in contribution of grain-boundary slippage into the total deformation