Supporting device for Toroidal coils
Description
Purpose: To reduce the response of a toroidal coil supporting device upon earthquakes and improve the earthquake proofness in a tokamak type thermonuclear device. Constitution: Structural materials having large longitudinal modulus and enduring great stresses, for example, stainless steels are used as the toroidal coil supporting legs and heat insulating structural materials are embedded in a nuclear reactor base mats below the supporting legs. Furthermore, heat insulating concretes are spiked around the heat insulating structural materials to prevent the intrusion of heat to the toroidal coils. The toroidal coils are kept at cryogenic state and superconductive state for the conductors. In this way, the period of proper vibrations of the toroidal coils and the toroidal coil supporting structures can be shortened thereby decreasing the seismic response. Furthermore, since the strength of the supporting legs is increased, the earthquake proofness of the coils can be improved. (Kamimura, M.)
Availability note (English)
Available from JAPIO. Also available from INPADOC.Additional details
Publishing Information
- Imprint Pagination
- 3 p.
- IPC:
- Int. Cl. G21B1/00; H01F5/00.
- IPC
- Int. Cl. G21B1/00; H01F5/00.
- Patent number
- JP patent document 60-50484/A/
INIS
- Country of Publication
- Japan
- Country of Input or Organization
- Japan
- INIS RN
- 17046153
- Subject category
- S70: PLASMA PHYSICS AND FUSION TECHNOLOGY;
- Resource subtype / Literary indicator
- Non-conventional Literature
- Descriptors DEI
- EARTHQUAKES; EIGENFREQUENCY; ELASTICITY; SEISMIC EFFECTS; STAINLESS STEELS; SUPERCONDUCTING COILS; SUPPORTS; THERMAL INSULATION; TOKAMAK DEVICES; TOROIDAL CONFIGURATION
- Descriptors DEC
- ALLOYS; ANNULAR SPACE; CARBON ADDITIONS; CLOSED PLASMA DEVICES; CONFIGURATION; ELECTRIC COILS; ELECTRICAL EQUIPMENT; EQUIPMENT; HIGH ALLOY STEELS; IRON ALLOYS; IRON BASE ALLOYS; MECHANICAL PROPERTIES; MECHANICAL STRUCTURES; STEELS; THERMONUCLEAR DEVICES
Optional Information
- Secondary number(s)
- JP patent application 58-157756.