Published November 3, 2008 | Version v1
Journal article

Observation of in-plane strain fluctuation in relaxed SiGe virtual substrate

  • 1. Graduate Institute of Electronics Engineering and Center for Condensed Matter Sciences, National Taiwan University, Taipei, 106, Taiwan (China)
  • 2. Department of Physics, University of Massachusetts Boston, Boston, Massachusetts (United States)
  • 3. United Microelectronics Corporation, Tainan 741, Taiwan (China)

Description

We investigate the morphology and strain distribution of the surface crosshatch undulation on a strain-relaxed SiGe layer grown on a low-temperature Si buffer layer by atomic force microscopy and spatially-resolved UV-Raman spectroscopy. Surface crosshatch undulation resulted from misfit dislocations at the SiGe/Si interface is associated with the strain relaxation in the SiGe layer. By means of thermal annealing, strain relaxes and the inhomogeneous in-plane strain fluctuation can be eliminated

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2008.08.075

Additional details

Identifiers

DOI
10.1016/j.tsf.2008.08.075;
PII
S0040-6090(08)00819-5;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
517
Journal Issue
1
Journal Page Range
p. 281-284
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
5. International conference on silicon epitaxy and heterostructures
Acronym
ICSI-5
Dates
20-24 May 2007
Place
Marseille (France)

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
40059010
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
ANNEALING; ATOMIC FORCE MICROSCOPY; DISLOCATIONS; FLUCTUATIONS; GERMANIUM SILICIDES; INTERFACES; LAYERS; MORPHOLOGY; RAMAN SPECTROSCOPY; RELAXATION; STRAINS; SURFACES
Descriptors DEC
CRYSTAL DEFECTS; CRYSTAL STRUCTURE; GERMANIUM COMPOUNDS; HEAT TREATMENTS; LASER SPECTROSCOPY; LINE DEFECTS; MICROSCOPY; SILICIDES; SILICON COMPOUNDS; SPECTROSCOPY; VARIATIONS

Optional Information

Copyright
Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.