Demountable, high density package for high-speed testing of superconducting circuits

This paper reports on a package that permits both quick integrated circuit (IC) throughput and high signal speed testing of superconducting devices and circuits. THe package contains 21 high-speed transmission lines and 64 dc bias lines contacting a 1 cm2 i.e. A novel demountable flip-chip connector incorporating both spring loaded and cantilever beam contacts maintains adequate chip to carrier continuity to allow signals from dc to 2 GHz to pass with minimal distortion at 4.2 K. The modular design of the connector and chip carrier allows maximum versatility in fast turnaround time testing