Published July 25, 2008 | Version v1
Journal article

Hot deformation behavior of Al18B4O33w/ZK60 magnesium matrix composite

  • 1. Department of Materials and Chemistry Engineering, Heilongjiang Institute of Technology, No. 999, Hong Qi-Da Street, Harbin 150050, Heilongjiang (China)
  • 2. Department of Materials Science, School of Materials Science and Engineering, Harbin Institute of Technology, No. 92, West Da-Zhi Street, P.O. Box 433, Harbin 150001, Heilongjiang (China)

Description

The hot deformation behavior of ZK60 magnesium alloy reinforced with 20 vol.% of Al18B4O33 whisker was investigated by compression testing in temperature range of 523-723 K and strain rate range of 0.001-10 s-1. The deformation behavior was mainly dependent on strain rate and temperature on certain strain condition. Variations of flow behavior with deformation temperature as well as strain rate were analyzed. The microstructural evolution at different temperatures and strain rates are mainly characterized by twinning, dislocation slip and dynamic recrystallization (DRX) during the hot compression. They were observed by transmission electronic microscope (TEM). It is shown that twinning occurred at lower temperature and earlier deformation stage. Twinning is the main reason for the high strain hardening rate at relatively low temperature. The material showed DRX at higher temperature and moderate strain rate, which is the reason for flow softening at relatively high temperature. Al18B4O33 whiskers promote nucleation of DRX. A fine dislocation substructure forms upon hot deformation, leading to subgrain formation

Availability note (English)

Available from http://dx.doi.org/10.1016/j.msea.2008.03.010

Additional details

Identifiers

DOI
10.1016/j.msea.2008.03.010;
PII
S0921-5093(08)00288-8;

Publishing Information

Journal Title
Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing
Journal Volume
487
Journal Issue
1-2
Journal Page Range
p. 495-498
ISSN
0921-5093
CODEN
MSAPE3

Optional Information

Copyright
Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.