Published April 23, 2007 | Version v1
Journal article

Suppression of hydrogen-ion drift into underlying layers using plasma deposited silicon oxynitride film during high-density plasma chemical vapor deposition

  • 1. Renesas Technology Corporation, 4-1 Mizuhara, Itami, Hyogo 664-0005 (Japan)
  • 2. Tokai University, 1117 Kitakaname Hiratsuka, Kanagawa 259-1292 (Japan)

Description

Hydrogen ions drifting into underlying layers during HDP-CVD were successfully suppressed by the insertion of plasma deposited silicon oxynitride (p-SiO xN yH z) film, and the hydrogen-trapping mechanism was clarified. The hydrogen ions are trapped in bonding states, not in interstitial ones. After HDP-CVD undoped silicate glass (HDP-USG) film deposition on the p-SiO xN yH z film, the decrease of the dangling bonds in the p-SiO xN yH z film measured by ESR was much lower than the increase of the desorbed hydrogen concentration measured by TDS. These results suggest that new hydrogen-trapping sites are mainly generated from ESR-inactive bonds by drifted hydrogen ions and atomic hydrogen during HDP-CVD

Additional details

Identifiers

DOI
10.1016/j.tsf.2006.10.035;
PII
S0040-6090(06)01233-8;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
515
Journal Issue
12
Journal Page Range
p. 4966-4970
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
3. International symposium on dry process
Dates
28-30 Nov 2005
Place
Jeju (Korea, Republic of)

Optional Information

Copyright
Copyright (c) 2006 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.