Characterization of ultrathin FDSOI stacks using low-field mobility
- 1. Technische Universität Bergakdemie Freiberg, Freiberg, 09599 (Germany)
Description
Herein, a method for the electrical characterization of a fully depleted silicon-on-insulator (FDSOI) high-k dielectric-metal-gate stack is proposed. The method is based on assessing low-field mobility in FDSOI field-effect transistor (FET) from current-voltage measurements at various temperatures in the gate voltage range up to strong inversion. In addition to assessing the value of the low-field mobility for the stack itself, it allows specifying the impact of various carrier-scattering mechanisms on the total stack mobility. Further, the application of double-gate operation in the optimal coupling mode for the FET allows analysis of the impact of the gate interfaces on mobility. The method can be used in the monitoring of stack quality and in the design and development of stack fabrication processes. (© 2022 The Authors. physica status solidi (a) applications and materials science published by Wiley‐VCH GmbH)
Availability note (English)
Available from: http://dx.doi.org/10.1002/pssa.202200133Additional details
Identifiers
Publishing Information
- Journal Title
- Physica Status Solidi. A, Applications and Materials Science (Online)
- Journal Volume
- 219
- Journal Issue
- 17
- Journal Page Range
- p. 1-10
- ISSN
- 1862-6319
- CODEN
- PSSABA
INIS
- Country of Publication
- Germany
- Country of Input or Organization
- Germany
- INIS RN
- 53110009
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- CARRIER MOBILITY; DIELECTRIC MATERIALS; ELECTRIC CONDUCTIVITY; ELECTRIC POTENTIAL; FABRICATION; INTERFACES; MOSFET; PERMITTIVITY; SILICON; TEMPERATURE DEPENDENCE; THICKNESS; THIN FILMS
- Descriptors DEC
- DIELECTRIC PROPERTIES; DIMENSIONS; ELECTRICAL PROPERTIES; ELEMENTS; FIELD EFFECT TRANSISTORS; FILMS; MATERIALS; MOBILITY; MOS TRANSISTORS; PHYSICAL PROPERTIES; SEMICONDUCTOR DEVICES; SEMIMETALS; TRANSISTORS
Optional Information
- Notes
- AID: 2200133; Gettering and defect engineering in semiconductor technology (GADEST 2022)