Published April 15, 2010 | Version v1
Journal article

Process and performance of hot dip zinc coatings containing ZnO and Ni-P under layers as barrier protection

  • 1. Central Metallurgical R and D Institute, P.O. Box 87, Helwan (Egypt)
  • 2. Chemistry Department, Faculty of Science, Cairo University, Giza (Egypt)

Description

A new coating system of under layer for hot dip zinc coating was explored as an effective coating for steel especially for application in relatively high aggressive environments. The influence of different barrier layers formed prior to hot dip galvanization was investigated to optimize high performance protective galvanic coatings. The deposition of ZnO and Ni-P inner layers and characteristics of hotdip zinc coatings were explored in this study. The coating morphology was characterized by scanning electron microscope (SEM) analysis. The hot dip zinc coatings containing under layer showed substantial improvement in their properties such as good adhesion, and high hardness. In addition, a decrease in the thickness of the coating layer and an enhancement of the corrosion resistance were found. Open circuit potential (OCP) of different galvanized layers in different corrosive media viz. 5% NaCl and 0.5 M H2SO4 solutions at 25 ± 1 deg. C was measured as a function of time. A nobler OCP was exhibited for samples treated with ZnO and Ni than sample of pure Zn; this indicates a dissolution process followed by passivation due to the surface oxide formation. The high negative OCP can be attributed to the better alloying reaction between Zn and Fe and to the sacrificial nature of the top pure zinc layer.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.apsusc.2010.01.119

Additional details

Identifiers

DOI
10.1016/j.apsusc.2010.01.119;
PII
S0169-4332(10)00159-5;

Publishing Information

Journal Title
Applied Surface Science
Journal Volume
256
Journal Issue
13
Journal Page Range
p. 4166-4170
ISSN
0169-4332
CODEN
ASUSEE

Optional Information

Copyright
Copyright (c) 2010 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.